this is information on a product in full production. january 2015 docid023184 rev 4 1/8 EMIF06-USD04F3 6-line low capacitance ipad? for micro-sd card with emi filtering and esd protection datasheet ? production data features ? emi low-pass filter ? esd protection 8 kv (iec 61000-4-2) ? integrated pull up resistors to prevent bus floating when no card is connected ? 208 mhz clock frequency compatible with sdr104 mode (sd3.0) ? lead-free package benefits ? low power consumption ? easy layout thanks to smart pin-out configuration ? very low pcb space consumption ? high reliability offered by monolithic integration ? reduction of parasitic elements thanks to csp integration complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) description the EMIF06-USD04F3 is a highly integrated device based on ipad technology offering two functions: esd protection to comply with iec standard, and emi filtering to reject mobile phone frequencies. figure 1. pin configuration (bump side) tm : ipad is a trademark of stmicroelectronics flip chip (15 bumps) 1 2 3 4 a b c d www.st.com
characteristics EMIF06-USD04F3 2/8 docid023184 rev 4 1 characteristics figure 2. EMIF06-USD04F3 schematic table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 (on pins vcc, sdclk, sdcmd, sddat0, sddat1, sddat2, sddat3 air discharge, external pins contact discharge, external pins esd discharge iec 61000-4-2, level 1 (on pins dat0, dat1, clk, cmd,dat3, dat2) air discharge, internal pins contact discharge, internal pins 15 8 2 2 kv t j maximum junction temperature 125 c t op operating temperature range - 30 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. pin configuration pin signal pin signal a1 dat0 c1 cmd a2 dat1 a3 sddat1 c3 gnd a4 sddat0 c4 sdcmd b1 clk d1 dat3 b2 v cc d2 dat2 b3 gnd d3 sddat2 b4 sdclk d4 sddat3
docid023184 rev 4 3/8 EMIF06-USD04F3 characteristics 8 figure 3. electrical characteristics (definitions) table 3. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 14 20 v i rm leakage current at v rm v rm = 3 v 100 na r1, r2, r3, r4, r5, r6 serial resistance tolerance 10%, matching 2% 40 r9, r10, r11, r12 pull-up resistance tolerance 10%, matching 2% 50 k r13 pull-up resistance on cmd tolerance 10% 15 k c line data line capacitance v = 0 v, f = 10 mhz, v osc = 30 mv 10 12 pf v = 1.8 v, f = 10 mhz, v osc = 30 mv 7.5 10 v = 2.9 v, f = 10 mhz, v osc = 30 mv 9 symbol parameter v = breakdown voltage v = stand-off voltage br rm i = leakage current at v rm rm = line capacitance c line v i v cl v br v rm i rm i pp figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency 100 k clk data0 data2 cmd2 1m 10m 100m 1g s21(db) 0 -10 -5 -15 -20 -25 -30 f(hz) data1 data3 100 k clk-data0 data3-sddata0 1m 10m 100m 1g xtalk(db) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 f(hz)
characteristics EMIF06-USD04F3 4/8 docid023184 rev 4 figure 8. line capacitance versus frequency and bias voltage (typical values) figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 0 1 2 3 4 5 6 7 8 9 10 11 12 1 10 100 f(mhz) v bias = 0v v bias = 1.8v v bias = 2.9v c line (pf) v osc = 30 mv rms t amb = 25 c
docid023184 rev 4 5/8 EMIF06-USD04F3 package information 8 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions figure 10. footprint figure 11. marking 1.54 mm 40 m 1.54 mm 40 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 500 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y z w x w dot, st logo ecopack status xx = marking yww = datecode y = year, ww = week z = manufacturing location
package information EMIF06-USD04F3 6/8 docid023184 rev 4 figure 12. tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensionsare in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 +0.3/-0.1 1.75 0.1 3.5 0.05 ? 1.55 0.05 0.59 0.05 1.65 0.05 0.20 0.02 st st st xxz yww xxz yww xxz yww e e e 1.65 0.05 st st st xxz yww xxz yww xxz yww e e e
docid023184 rev 4 7/8 EMIF06-USD04F3 ordering information 8 3 ordering information figure 13. ordering information scheme note: more information is available in the stmicroelectronics application notes: an2348: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? an4541: ?emi filters for sd3.0 card: high speed sd card protection and filtering devices? 4 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF06-USD04F3 jz flip chip 2.6 mg 5000 tape and reel 7? emif 06 - usd 04 f3 emi filter number of lines application usd = micro sd card version 04 = design version package f = flip chip 3= lead-free, pitch = 400 m, bump = 255 m table 5. document revision history date revision changes 09-may-2012 1 first issue. 27-jun-2012 2 added tolerances in figure 12 . 30-jun-2014 3 updated figure 4 , figure 5 and breakdown voltage value in table 3 . 06-jan-2015 4 added mention for new an4541.
EMIF06-USD04F3 8/8 docid023184 rev 4 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved
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